Papers › Radiation tolerant, thin, passive CMOS sensors read out with the RD53A chip
Radiation tolerant, thin, passive CMOS sensors read out with the RD53A chip
Yannick Dieter, Michael Daas, Jochen Dingfelder, Tomasz Hemperek, Fabian Hügging, Jens Janssen, Hans Krüger, David-Leon Pohl, Marco Vogt, Tianyang Wang, Norbert Wermes, Pascal Wolf
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The radiation hardness of passive CMOS pixel sensors fabricated in 150 nm LFoundry technology is investigated. CMOS process lines are especially of interest for large-scale silicon detectors as they offer high production throughput at comparatively low cost. Moreover, several features like poly-silicon resistors, MIM-capacitors and several metal layers are available which can help enhance the sensor design. The performance of a 100 μm thin passive CMOS sensor with a pixel pitch of 50 μm at different irradiation levels, 5 × 10¹⁵n_(eq)cm⁻² and 1 × 10¹⁶n_(eq)cm⁻², is presented. The sensor was bump-bonded and read out using the RD53A readout chip. After the highest fluence a hit-detection efficiency larger than 99% is measured for minimum ionising particles. The measured equivalent noise charge is comparable to conventional planar pixel sensors. Passive CMOS sensors are thus an attractive option for silicon detectors operating in radiation harsh environments like the upgrades for the LHC experiments.
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